25 thin-film technology accu-l thin-film rf/microwave inductors 2
l t b w operating/storage temp. range: -55? to +125? dimensions: millimeters (inches) 0603 0805 l 1.6?.10 2.11?.10 (0.063?.004) (0.083?.004) w 0.81?.10 1.5?.10 (0.032?.004) (0.059?.004) t 0.61?.10 0.91?.13 (0.024?.004) (0.036?.005) top: 0.0 +0.3/-0.0 0.25?.15 b (0.0+0.012) (0.010?.006) bottom: 0.35?.20 (0.014?.008) 26 2 accu-l smd high-q rf inductor accu-l technology the accu-l smd inductor is based on thin-film multilayer technology. this technology provides a level of control on the electrical and physical characteristics of the component which gives consistent characteristics within a lot and lot-to-lot. the original design provides small size, excellent high- frequency performance and rugged construction for reliable automatic assembly. features ?high q ?rf power capability ?high srf ?low dc resistance ?ultra-tight tolerance on inductance ?standard 0603 and 0805 chip size ?low profile ?rugged construction ?taped and reeled the accu-l inductor is particularly suited for the telecom- munications industry where there is a continuing trend towards miniaturization and increasing frequencies. the accu-l inductor meets both the performance and tolerance requirements of present cellular frequencies 450mhz and 900mhz and of future frequencies, such as 1700mhz, 1900mhz and 2400mhz. applications ?mobile communications ?satellite tv receivers ?gps ?vehicle locations systems ?filters ?matching networks 10 nh inductor (top view)
27 2 accu-l ? 0603 and 0805 smd high-q rf inductor how to order 450 mhz 900 mhz 1900 mhz 2400 mhz i dc max test frequency test frequency test frequency test frequency srf min r dc max (ma) inductance available q l (nh) q l (nh) q l (nh) q (mhz) ( ? ) l (nh) inductance tolerance typical typical typical typical (1) 1.2 ?.1, ?.2nh 49 1.2 70 1.2 134 1.2 170 10000 0.04 1000 1.5 ?.1, ?.2nh 26 1.54 39 1.52 63 1.52 76 10000 0.06 1000 1.8 ?.1, ?.2nh 20 1.74 30 1.73 50 1.72 59 10000 0.07 1000 2.2 ?.1, ?.2nh 20 2.2 30 2.24 49 2.24 56 10000 0.08 1000 2.7 ?.1, ?.2nh 21 2.7 30 2.75 48 2.79 54 9000 0.08 750 3.3 ?.1, ?.2, ?.5nh 24 3.33 35 3.39 56 3.47 64 8400 0.08 750 3.9 ?.1, ?.2, ?.5nh 25 3.9 57 4.06 60 4.21 69 6500 0.12 500 4.7 ?.1, ?.2, ?.5nh 23 4.68 32 4.92 46 5.2 49 5500 0.15 500 5.6 ?.2, ?.5nh 26 5.65 36 5.94 54 6.23 60 5000 0.25 300 6.8 ?.2, ?.5nh 23 6.9 33 7.3 47 8.1 39 4500 0.30 300 8.2 ?.2, ?.5nh 23 8.4 31 10 35 12.1 31 3800 0.35 300 10.0 ?%, ?% 28 10 39 11.8 47 14.1 41 3500 0.45 300 12.0 ?%, ?% 28 13.2 38 14.1 30 17.2 20 3000 0.50 300 15.0 ?%, ?% 28 16.2 38 25.9 30 49.8 15 2500 0.60 300 (1) i dc measured for 15? rise at 25? ambient temperature (2) i dc measured for 70? rise at 25? ambient temperature l, q, srf measured on hp 4291a, boonton 34a and wiltron 360 vector analyzer, r dc measured on keithley 580 micro-ohmmeter. electrical specifications table for accu-l 0603 450 mhz 900 mhz 1700 mhz 2400 mhz i dc max test frequency test frequency test frequency test frequency srf min r dc max (ma) inductance available q l (nh) q l (nh) q l (nh) q (mhz) ( ? ) ? t = 15? ? t = 70? l (nh) inductance tolerance typical typical typical typical (1) (2) 1.2 ?.1nh, ?.2nh, ?.5nh 60 1.2 92 1.2 122 1.2 92 10000 0.05 1000 2000 1.5 ?.1nh, ?.2nh, ?.5nh 50 1.5 74 1.5 102 1.5 84 10000 0.05 1000 2000 1.8 ?.1nh, ?.2nh, ?.5nh 50 1.8 72 1.8 88 1.9 73 10000 0.06 1000 2000 2.2 ?.1nh, ?.2nh, ?.5nh 42 2.2 62 2.2 82 2.3 72 10000 0.07 1000 2000 2.7 ?.1nh, ?.2nh, ?.5nh 42 2.7 62 2.8 80 2.9 70 10000 0.08 1000 2000 3.3 ?.1nh, ?.2nh, ?.5nh 38 3.3 46 3.4 48 3.5 57 10000 0.11 750 1500 3.9 ?.1nh, ?.2nh, ?.5nh 27 3.9 36 4.0 38 4.1 42 10000 0.20 750 1500 4.7 ?.1nh, ?.2nh, ?.5nh 43 4.8 62 5.3 76 5.8 60 5500 0.10 750 1500 5.6 ?.5nh 50 5.7 68 6.3 73 7.6 62 4600 0.10 750 1500 6.8 ?.5nh 43 7.0 62 7.7 71 9.4 50 4500 0.11 750 1500 8.2 ?.5nh 43 8.5 56 10.0 55 15.2 32 3500 0.12 750 1500 10 ?%, ?% 46 10.6 60 13.4 52 2500 0.13 750 1500 12 ?%, ?% 40 12.9 50 17.3 40 2400 0.20 750 1500 15 ?%, ?% 36 16.7 46 27 23 2200 0.20 750 1000 18 ?%, ?% 30 21.9 27 1700 0.35 500 1000 22 ?%, ?% 36 27.5 33 1400 0.40 500 1000 electrical specifications table for accu-l 0805 (1) i dc measured for 15? rise at 25? ambient temperature when soldered to fr-4 board. inductance and q measured on agilent 4291b / 4287 using the 16196a test fixture. rohs compliant pb: free please select correct termination style engineering kits available see pages 75-76 l product inductor 0805 size 0603 0805 4r7 inductance expressed in nh (2 significant digits + number of zeros) for values <10nh, letter r denotes decimal point. example: 22nh = 220 4.7nh = 4r7 d tolerance for l 4.7nh, b = ?.1nh c = ?.2nh d = ?.5nh 4.7nh 28 2 typical inductance vs. frequency l0805 measured on hp4291a and wiltron 360 vector analyzer 100 10 inductance (nh) 1 22nh 15nh 10nh 5.6nh 1.8nh 0.01 0.1 frequency (ghz) 110 200 100 10 1 0 3.5 3 2.5 2 1.5 1 0.5 15nh 10nh 6.8nh 4.7nh 2.7nh current (a) temperature rise will typically be no higher than shown by the graph ? ? t (?) maximum temperature rise at 25? ambient temperature (on fr-4) l0805 accu-l ? 0603 and 0805 smd high-q rf inductor typical q vs. frequency l0805 measured on hp4291a and boonton 34a coaxial line 0.1 0 20 40 q 60 100 120 140 80 1 22nh 15nh 10nh 5.6nh 1.8nh 1.5nh 1.2nh 10 frequency (ghz) typical inductance vs. frequency l0603 15nh 8.2nh 6.8nh 4.7nh 3.3nh 2.2nh 1.8nh 1.2nh 100 10 1 0 0.5 1 1.5 frequency (ghz) l (nh) 2 2.5 3 180 160 140 120 100 80 60 40 20 0 012 frequency (ghz) q 3 1.2nh 1.5nh 5.6nh 8.2nh 15nh typical q vs. frequency l0603 measured on agilent 4291b/4287 using the 16196a test fixture measured on agilent 4291b/4287 using the 16196a test fixture l0805 l0603
29 2 accu-l ? 0603 and 0805 smd high-q rf inductor test conditions requirement solderability components completely immersed in terminations to be well tinned. a solder bath at 235 5? for 2 secs. no visible damage. leach resistance components completely immersed in dissolution of termination faces a solder bath at 260 ?? for 60 secs. 15% of area. dissolution of termination edges 25% of length. storage 12 months minimum with components good solderability stored in ?s received?packaging. shear components mounted to a substrate. no visible damage a force of 5n applied normal to the line joining the terminations and in a line parallel to the substrate. rapid change of components mounted to a substrate. no visible damage temperature 5 cycles -55? to +125?. tested as shown in diagram bend strength no visible damage temperature component placed in +0 to +125 ppm/? coefficient of environmental chamber (typical) inductance -55? to +125?. (tcl) t 1 = 25? final quality inspection finished parts are tested for electrical parameters and visual/ mechanical characteristics. parts are 100% tested for inductance at 450mhz. parts are 100% tested for r dc . each production lot is evaluated on a sample basis for: ?q at test frequency ?static humidity resistance: 85?, 85% rh, 160 hours ?endurance: 125?, i r , 4 hours 1mm deflection 45mm 45mm tcl = 10 6 l 2 -l 1 l 1 (t 2 -t 1 ) environmental characteristics
30 2 30 accu-l ? 0805 application notes handling smd chips should be handled with care to avoid damage or contamination from perspiration and skin oils. the use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. bulk handling should ensure that abrasion and mechanical shock are min- imized. for automatic equipment, taped and reeled product is the ideal medium for direct presentation to the placement machine. circuit board type all flexible types of circuit boards may be used (e.g. fr-4, g-10) and also alumina. for other circuit board materials, please consult factory. component pad design component pads must be designed to achieve good joints and minimize component movement during soldering. pad designs are given below for both wave and reflow soldering. the basis of these designs is: a. pad width equal to component width. it is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. b. pad overlap about 0.3mm. c. pad extension about 0.3mm for reflow. pad extension about 0.8mm for wave soldering. preheat & soldering the rate of preheat in production should not exceed 4?/second. it is recommended not to exceed 2?/ second. temperature differential from preheat to soldering should not exceed 150?. for further specific application or process advice, please consult avx. hand soldering & rework hand soldering is permissible. preheat of the pcb to 100? is required. the most preferable technique is to use hot air soldering tools. where a soldering iron is used, a tempera- ture controlled model not exceeding 30 watts should be used and set to not more than 260?. maximum allowed time at temperature is 1 minute. when hand soldering, the base side (white side) must be soldered to the board. cooling after soldering, the assembly should preferably be allowed to cool naturally. in the event of assisted cooling, similar condi- tions to those recommended for preheating should be used. cleaning recommendations care should be taken to ensure that the devices are thor- oughly cleaned of flux residues, especially the space beneath the device. such residues may otherwise become conduc- tive and effectively offer a lossy bypass to the device. various recommended cleaning conditions (which must be optimized for the flux system being used) are as follows: cleaning liquids . . . . . . i-propanol, ethanol, acetylace- tone, water, and other standard pcb cleaning liquids. ultrasonic conditions . . power ?20w/liter max. frequency ?20khz to 45khz. temperature . . . . . . . . . 80? maximum (if not otherwise limited by chosen solvent system). time. . . . . . . . . . . . . . . 5 minutes max. storage conditions recommended storage conditions for accu-l prior to use are as follows: temperature. . . . . . . . . 15? to 35? humidity . . . . . . . . . . . 65% air pressure . . . . . . . . . 860mbar to 1060mbar recommended soldering profile for recommended soldering profile see page 23 reflow soldering dimensions: millimeters (inches) wave soldering dimensions: millimeters (inches) 1.2 (0.047) 1.2 (0.047) 1.4 (0.055) 3.8 (0.150) 1.5 (0.059) 0805 accu-l 0.7 (0.028) 0.7 (0.028) 1.4 (0.055) 2.8 (0.110) 1.5 (0.059) 0805 accu-l 1.30 (0.051) 1.30 (0.051) 0.50 (0.020) 3.1 (0.122) 0.8 (0.031) 0603 accu-l 0 . 90 ( 0.035 ) 0 . 90 ( 0.035 ) 0 . 50 ( 0.020 ) 2. 3 ( 0.091 ) 0 . 8 ( 0.031 ) 0603 accu-l
|
